Extrude the substrate

Create your substrate from a large choice of advanced polymers.

lay the tracks

Add conductive material in order to establish the interconnect.

Pick'n place


Place passive and active components as well as non printable connectors.

Quality controle

Verify functionality and validate the constraints.

An innovative technology: 3D-MiS*.

*3D Mechatronic integrated Systems


Integration

  • Mechanical features
  • Electronic features
  • CEM protection,  hardening...
  • 3D electronics

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Customization

  • Advanced polymers
  • Serial numbers and screen printing
  • Geometry

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